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佳臻工贸有限公司

J. Z. Industry & Trade Co., Ltd.

ASNP# Anti-Siphon Nonwoven Insole(Without Resin & Filler)
  • Product: Anti-Siphon Nonwoven Insole Board

    Quality: ASNP#

    Thickness: 0.80--3.00MM.

    Packing: Sheets, polybag or in Pallet's Packing.

    Product Features: Without any Resin & Filler, Thermoformed, Lightweight, Non-Wicking after back-end processing.
    Applications: Suitable for safety shoes & outdoor shoes & snow boots and other high-end shoes which needs anti-siphon function. 


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